| Specification |
Metal Coating: Gold;
Mode of Production: SMT/ Thru-Hole;
Layers: 1 - 32 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCB Thickness: No Limit;
PCBA Order Volume: No Limit;
Layer Stackup: All Stack-up;
Edge Rails: Necessary;
Fiducials: Necessary;
Minimum Package: 1005;
Minimum IC Pin Spacing: 0.3mm;
Minimum BGA Spacing: 0.3mm;
Mounting Machine: Nxt-M6III;
Spi: Yes;
Aoi: Yes;
Visual Inspection: Yes;
Function Test: Yes;
Conformal Coating: Yes;
PCBA Potting: Yes;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day, 600 Million/Month;
Component Size: 01005, LGA, Fine Pitch BGA, Qfn;
Traceability: Full Barcode/Mes System(Component, Batch, Porcess);
Machine Detail: 21 SMT Lines, 4 DIP Lines;
Assembly Detail: SMT, Pop, DIP, COB, Flip Chip, SIP;
Inspection: Aoi, Spi, X-ray, Ict&Fct;
Value-Added Service: Bom Analysis, Confirmal Coating, Programming;
Certifications: ISO9001, ISO14001, IATF16949, CSR, Hsf, QC080000;
Material: Complex;
Package: Carton;
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