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Dustproof PCB
US$0.50 / Piece
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What is Dustproof Multilayer PCB Manufacturing for Long-Lasting Electronic Solutions

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Pieces US$0.50 / Piece

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS
  • Customized Customized
  • Condition New
  • Transport Package Carton
  • Specification Customized
  • Trademark SNT
  • Origin China
  • Type Combining Rigid Circuit Board
  • Dielectric Fr-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Snt
  • Usage Playback Switch, Disconnector, Change-Over Switch, Control Switch
  • Number of Switch Multi Control Switch
  • Structure PCB
  • Contact Type FPC Terminal Connector
  • Detection Method Circuit Function Testing Equipment
  • Certification RoHS
  • Function Durable, Waterproof, Dustproof, UV Resistant
  • Logo/Design Customized
  • Dimension/Shape OEM Service
  • Color Pantone, Ral, Cmyk

Product Description

Product Description (Customized option) Item Specifications Double side Multi-layer Board No.of Layer 2 4~16 Coppor foil thickness 0.5~3.0OZ 0.5~3.0OZ Material thickness 0.4~2.0mm 0.6~2.0mm Flammability Grade 94V-0 94V-0 Peel Strength 12.3N/cm 12.3N/cm Bow/Twist ≤0.7% ≤0.7% Surface Resistivity ...

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Dustproof PCB Comparison
Transaction Info
Price US$0.50 / Piece US$3.68-9.00 / Piece US$0.20-20.00 / Piece US$0.87-5.00 / Piece US$0.76-5.00 / Piece
Min Order 5 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms T/T T/T T/T T/T T/T
Quality Control
Product Certification RoHS ISO RoHS, ISO RoHS, CCC, ISO RoHS, ISO
Management System Certification ISO9001:2015, ISO14001 ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Combining Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Snt;
Usage: Playback Switch, Disconnector, Change-Over Switch, Control Switch;
Number of Switch: Multi Control Switch;
Structure: PCB;
Contact Type: FPC Terminal Connector;
Detection Method: Circuit Function Testing Equipment;
Function: Durable, Waterproof, Dustproof, UV Resistant;
Logo/Design: Customized;
Dimension/Shape: OEM Service;
Color: Pantone, Ral, Cmyk;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

SNT Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

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