| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Finished Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Plastic;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Battery Type: LiFePO4, Limno4, AGM, Gell, Flooded Battery;
Battery Capacity: Unlimited;
Battery Method: Energy Transfer/Dynamic;
Power Consumption: Lower Than 50MW;
Balance Current: 6A;
Work Efficiency: Over 94%;
OEM: Yes;
Size: 85mm X 45mm X 25mm;
Weight: 100g;
BMS Limited: Can Work with BMS or Can Work Independently;
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Metal Coating: Plastic;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Battery Type: LiFePO4, Limno4, AGM, Gell, Flooded Battery;
Battery Capacity: Unlimited;
Battery Method: Energy Transfer/Dynamic;
Power Consumption: Lower Than 50MW;
Balance Current: 3A;
Work Efficiency: Over 94%;
OEM: Yes;
Weight: 550g;
BMS Limited: Can Work with BMS or Can Work Independently;
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Metal Coating: Copper/Tin/Gold/Silver;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used/New;
Service: PCB/Componentssourcing/Assembly/Test/Package;
Layer: 1-20 Layers;
PCB Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1/ etc.;
Surface Finished: HASL/Lead Free/OSP/Immersion Gold etc.;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
Copper Thickness: 18um-3500um(0.5- 100oz);
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
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