| Specification |
Metal Coating: Tin;
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing,Flying Probe Tester,Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Item: Fr4 1.6mm PCB Android Phone PCB Android Phone PCB;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCB Soldermask: Green;
PCB Silkscreen: White;
PCB Thickness: 0.6mm;
PCB Layer: 4 Layers;
Surface Finished: HASL Lead Free;
Copper Thickness: 1oz Copper;
PCB Materials: RF4 Tg170;
PCBA Mini Footprint: 01005;
IC: BGA;
IC Type: Qfn;
PCB Type: Rigid PCB;
PCB Tg: Tg;
Aoi: 100% Checking;
BGA: X-ray 100% Testing;
SMT Mini Size: 01005;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing,Flying Probe Tester,Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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