| Specification |
Material: Plastic;
Interface Type: USB 2.0;
Degree of Innovation: Innovative;
Applicable Brands: Sonny, Android, iPhone;
Module Size: 60mm*8.5mm*6.7mm;
Assembly Technique: SMT (Rosh);
Focus: Fix;
Resolution: 2592*1944;
PCB Printing Ink: Black;
Interface: USB 2.0;
Power: USB Bus Power;
Output Formats: Yuv/Mjpg;
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Material: Fr4 PCB;
Interface Type: USB 2.0;
Degree of Innovation: Innovative;
Applicable Brands: Fr4;
Type: USB Writing Board;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Blue/Green/Red/Black/Yellow;
Silk Screen: White;
Flying Probe Test: Yes;
Product Name: Prototype Multi-Layer PCB HDI PCB Circuit Board;
Service: One-Stop;
Mini Hole Size: 0.1mm;
Layers: Multilayers;
Max Board Thickness: 3.6mm;
Testing: 100%;
MOQ: 1PCS;
Supply: Fast;
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Material: Metal;
Interface Type: USB 2.0;
Degree of Innovation: Traditional;
Applicable Brands: Sonny, Android, iPhone, Consumer Electronics;
Type: USB Adapter;
Insulation Resistance: 1000mohms,Min.;
Current Rating: 2.0AMP;
Contact Resistance: 30mohms,Max.;
Withstanding Voltage: 500V AC;
MOQ: 100 PCS;
Sample: Free;
Inspection: 100% Check;
Others: Pin Header,Wafer,Housing&Terminals,etc.;
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Material: Metal;
Interface Type: USB 2.0;
Degree of Innovation: Innovative;
Applicable Brands: Fpi;
Type: USB Hub;
Insulation Resistance: 1000mohms,Min.;
Current Rating: 1.5AMP;
Contact Resistance: 30mohms,Max.;
Withstanding Voltage: 500V AC;
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Material: Metal;
Interface Type: USB 2.0;
Degree of Innovation: Innovative;
Applicable Brands: Fpi;
Type: USB Hub;
Insulation Resistance: 1000mohms,Min.;
Contact Resistance: 30mohms,Max.;
Current Rating: 1.5AMP;
Withstanding Voltage: 500V AC;
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