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Development Board
US$8.50-15.00 / Piece
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What is PCBA Turnkey Development Industrial Control Machine PCB Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$15.00

1,000-9,999 Pieces US$10.00

10,000+ Pieces US$8.50

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Double-Layer
  • Base Material FR-4
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition Used
  • Transport Package Individual Bubble Bag and Carton
  • Specification custumized
  • Trademark Grandtop
  • Origin China
  • MOQ No Required
  • Delivery Term 7-15days
  • Shipment Air, Sea, Express(DHL TNT FedEx EMS UPS)
  • Processing Technology Electrolytic Foil
  • Flame Retardant Properties V0
  • Material Polyester Glass Fiber Mat Laminate
  • Insulation Materials Epoxy Resin
  • Surface Treatment Immersion Gold/HASL Lead Free/OPS/ Immersion Silve
  • Certificate UL(Us&Canada). ISO9001. RoHS, Ts, SGS

Product Description

PCBA Turnkey Development Industrial Control Machine PCB Board Items Capability PCB Layers 1-28 layers PCB material FR4, FR5, Aluminium,High Tg FR4, Halogen Free, Isola, Rogers PCB Finished Board Thickness 0.2mm ~ 7.0mm(8mil-276mil) PCB Copper Thickness 1/3oz ~ 7oz PCB Max ...

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Development Board Comparison
Transaction Info
Price US$8.50-15.00 / Piece US$0.65-5.00 / Piece US$0.20-10.00 / Piece US$0.98-5.00 / Piece US$2.58-8.00 / Piece
Min Order 100 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms T/T T/T T/T T/T T/T
Quality Control
Product Certification UL(Us&Canada). ISO9001. RoHS, Ts, SGS ISO RoHS, CCC, ISO RoHS, ISO RoHS, CCC, ISO
Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
MOQ: No Required;
Delivery Term: 7-15days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
Processing Technology: Electrolytic Foil;
Flame Retardant Properties: V0;
Material: Polyester Glass Fiber Mat Laminate;
Insulation Materials: Epoxy Resin;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Tin;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

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