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SMT&DIP Assembly
US$1.00-25.00 / Piece
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What is Professional PCB Assembly Factory with One-Stop Service

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-25.00 / Piece

Sepcifications

  • Metal Coating Copper / Tin / Gold / Sliver
  • Mode of Production SMT&DIP
  • Layers Singer-Layer/Double-Layer/Multilayer(Max 64layers)
  • Base Material FR-4
  • Certification RoHS, ISO, ISO13485 & IATF16949 & ISO9001
  • Customized Customized
  • Condition Used
  • Transport Package DHL&UPS
  • Specification 25*21*2 cm
  • Trademark Grandtop
  • Origin Guangdong China
  • BGA Minimum Dia 01015
  • PCBA Min. IC Pitch 0.30mm(12mil)
  • PCB Layer Max 64 Layers
  • PCBA Foot Pin So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA
  • Function Testing Spi , Aoi, Ict, Fct , X-ray ,RoHS and Aging
  • IP Protection Strong Believe in IP Protection with Proven Record
  • Turkey Service Turkey Sourcing ,Procurement and Material Manageme

Product Description

Grandtop Group was established in 2005, specializing in high quality PCBA OEM &ODM,we have more than 10 years' experience in PCBA contract manufacturing, professionally providing SMT, DIP, MI, AI, PCB assembling, conformal coating, final product assembling, testing, material procurement . Our ...

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SMT&DIP Assembly Comparison
Transaction Info
Price US$1.00-25.00 / Piece US$6.20 / Piece US$6.20 / Piece US$6.20 / Piece US$6.20 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P
Quality Control
Product Certification RoHS, ISO, ISO13485 & IATF16949 & ISO9001 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Copper / Tin / Gold / Sliver;
Mode of Production: SMT&DIP;
Layers: Singer-Layer/Double-Layer/Multilayer(Max 64layers);
Base Material: FR-4;
Customized: Customized;
Condition: Used;
BGA Minimum Dia: 01015;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCB Layer: Max 64 Layers;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Function Testing: Spi , Aoi, Ict, Fct , X-ray ,RoHS and Aging;
IP Protection: Strong Believe in IP Protection with Proven Record;
Turkey Service: Turkey Sourcing ,Procurement and Material Manageme;
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

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