| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: New Chip;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
Service: OEM / Dfm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
Surface Finishing: Enig;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Layer: 1 to 18;
Min. Hole Size: 0.07mm;
Min.Line Width: 0.1mm;
Min.Line Spacing: 0.1mm;
Finishing: Hal, OSP, Immersion;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Andriod Pab Board;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Silkscreen: White, Black, Green, Yellow;
Soldermask: White, Black, Green, Yellow;
Surface Finishing: HASL;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Board Thickness: 1.0mm;
Copper Thickness: 1oz;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Andriod Pab Board;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Silkscreen: White, Black, Green, Yellow;
Soldermask: White, Black, Green, Yellow;
Surface Finishing: HASL;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Board Thickness: 1.0mm;
Copper Thickness: 1oz;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
Surface Finishing: Enig;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Layer: 1 to 18;
Min. Hole Size: 0.07mm;
Min.Line Width: 0.1mm;
Min.Line Spacing: 0.1mm;
Finishing: Hal, OSP, Immersion;
|
