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Precision Assembly
US$6.20 / Piece
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What is Precision Multilayer PCB Electronics Assembly for Enhanced Device Functionality

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$6.20 / Piece

Sepcifications

  • Metal Coating Gold
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, CCC, ISO, UL,IATF16949
  • Customized Customized
  • Condition New
  • Transport Package Vacuum Packing, Blister, Plastic, Cartoon
  • Specification 123x256 mm
  • Trademark MZH
  • Origin China
  • Material Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250)
  • Number of Layers 1-48 Layers
  • Board Thickness 0.2-6.0 mm
  • Copper Thickness 0.5-12 Oz
  • Service PCB+PCBA+Components+Reverse Engineer
  • Application Communications, Industrial Control, Semiconductors
  • Min Board Size 5 X 5 mm
  • Max Board Size 900 X 600 mm
  • Min Hole Size 0.15 mm
  • Surface Finishing Lf Hal, OSP,Enig, Enepig,Immersion Silver
  • Min BGA Ball Pitch 0.4mm
  • DIP Capacity 100 Thousand Pins/Day
  • Solder Resist Color Green,Blue, Red,Yellow,Black,White,Orange
  • PCBA-Testing Aoi,X-ray,Function Test
  • Delivery Time Within 3 Days(Sample)

Product Description

Double-sided panel Double-sided panels are widely used in electronic devices with limited space but complex functionality. Our double-sided PCBs integrate precision etching, via metallization, and solder mask screen printing processes, supporting mixed SMT and through-hole assembly. They maximize ...

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Precision Assembly Comparison
Transaction Info
Price US$6.20 / Piece US$1.88-18.88 / Piece US$1.88-18.88 / Piece US$1.88-18.88 / Piece US$291.00-300.00 / Set
Min Order 1 Piece 5 Pieces 5 Pieces 5 Pieces 1 Set
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Supplier Name

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Guangdong Chico Future Technology Group Inc.

Diamond Member Audited Supplier

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