| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT Surface Mount+DIP Plugin;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Location Tracker PCBA;
Function: Positioning and Health Data Tracki;
Color: Customized Colors;
Wireless Type: Blue Tooth+4G;
Application: Android Ios;
MOQ: 1000PCS;
Material: ABS+PCB;
Battery Type: Rechargeable Lithium-Ion Polymer;
Protocol: BLE Dual Protocol;
Usage: Track Activity;
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Metal Coating: Copper;
Mode of Production: SMT Surface Mount+DIP Plugin;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Location Tracker PCBA;
Function: Positioning and Health Data Tracki;
Color: Customized Colors;
Wireless Type: Blue Tooth+4G;
Application: Android Ios;
MOQ: 1000PCS;
Material: ABS+PCB;
Battery Type: Rechargeable Lithium-Ion Polymer;
Protocol: BLE Dual Protocol;
Usage: Track Activity;
|
Metal Coating: Copper;
Mode of Production: SMT Surface Mount+DIP Plugin;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Location Tracker PCBA;
Function: Positioning and Health Data Tracki;
Color: Customized Colors;
Wireless Type: Blue Tooth+4G;
Application: Android Ios;
MOQ: 1000PCS;
Material: ABS+PCB;
Battery Type: Rechargeable Lithium-Ion Polymer;
Protocol: BLE Dual Protocol;
Usage: Track Activity;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Board Thickness: 0.2-8.0mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict), Func;
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Profiling Punching: Routing, V-Cut, Beveling;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Te;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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