| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Operating System: OEM;
PCB Testing: Flying Probe PCB Testing;
Applications: Industrial Equipment Board;
Design Philosophy: Customize;
Stocking Time: 3-5 Days;
Functional Application: Global Electronic Industry Application Fields;
Copper Thickness: 0.5oz~12oz(14.17g~340.19g);
Supplier Type: Original Manufacturer/OEM/EMS;
PCBA Service: SMT, DIP, One-Stop Turnkey PCBA Service;
Surface Finish: HASL, Enig, Immersion Ti, Immersion Silver, etc.;
Material: Fr-4/Fr1/Cem-1/Cem-3/Polyimild/PTFE/Rogersaluminum;
Color: Blue. Green. Red. Black;
Testing: 100% Aoi / X-ray / Ict/Aging Test/Functional Test;
Solder Type: Lead-Free - RoHS Compliant;
Stencils: Laser-Cut Stainless Steel Stencil;
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Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Rated Power Input: 3kw/4kw/5kw/6kw/7kw/8kw/10kw/12kw/15kw/18kw/25kw;
Rated Voltage: Single Phase AC220V, Three Phase AC380V;
Heat-Dissipating Method: Air Cooling, Liquid Cooling;
Operating Power Frequency: 50/60 Hz;
Type of Compressor: BLDC/Pmsm;
Communicated Method: RS485;
Refrigerant: R410;R32;R290;
Function: Cooling, Heating, Hot Water, Solar Power;
Remote Control: WiFi, APP;
Interaction: Touch Screen, Touch Button;
Ota Upgrade Support: Support Ota;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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