| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Test: Aoi/Spi/X-ray;
Packing: Carton/ Vacuum/ Plastic;
Delivery Time: Sample 7-15 Days;
SMT Jointing: 1206/0805/0603;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Name: PCBA Assembly Manufacturing;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: PCB Design/Assembly, PCBA & EMS;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Type: Cash Register Control Board PCBA;
Item: Cash Register Control PCBA;
Other: Control Board PCBA;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
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Metal Coating: Copper/ Gold / Tin;
Mode of Production: SMT/DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.3mm;
Processing Technology: Electrolytic Foil;
Other Service: SMT, DIP, EMS;
Insulation Materials: Organic Resin;
PCB Finished Board Thickness: 0.2~7.0mm;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Conformal Coating: Conformal Coating Machine and UV Oven;
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