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OEM PCB Design
US$0.30-4.50 / pieces
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What is Advanced PCB Testing Solutions for Reliable High-Quality Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 pieces US$4.50

100-999 pieces US$1.00

1,000+ pieces US$0.30

Sepcifications

  • Metal Coating Gold
  • Mode of Production SMT
  • Layers Single-Layer
  • Base Material FR-4
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package Box Packing
  • Specification stock size
  • Trademark GW
  • Origin Guangdong, China
  • Service One-Step Service
  • Model Number Tandard
  • Testing Service 100%
  • Material Fr4, Hi-Tg, Fr06, Rogers, Taconic,Argon, Nalco, Ls
  • Solder Mask Color Green, Yellow, White, Blue, Black, Red...
  • Place of Origin China
  • Type Channel Digital Amplifier
  • Description Channel Digital Amplifier
  • Best Price Please Contact Us
  • Shipping by DHL\UPS\FedEx\EMS\TNT\Aramex
  • Lead Time Lead Time
  • Payment Paypal\Tt\Western Union\ Trade Assurance

Product Description

Our Services Pcb Assembly Capability Single and double sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Min Chips size 01005 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch 0.008 in. (0.2 mm) ...

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OEM PCB Design Comparison
Transaction Info
Price US$0.30-4.50 / pieces US$0.65-6.00 / Piece US$0.67-5.00 / Piece US$0.65-6.00 / Piece US$2.50-6.00 / Piece
Min Order 1 pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms LC, T/T, PayPal, Western Union T/T T/T T/T T/T
Quality Control
Product Certification RoHS, CCC, ISO RoHS, ISO RoHS, ISO RoHS, ISO RoHS, CCC, ISO
Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Domestic Domestic Domestic Domestic
Annual Export Revenue 20,000,000 RMB - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: One-Step Service;
Model Number: Tandard;
Testing Service: 100%;
Material: Fr4, Hi-Tg, Fr06, Rogers, Taconic,Argon, Nalco, Ls;
Solder Mask Color: Green, Yellow, White, Blue, Black, Red...;
Place of Origin: China;
Type: Channel Digital Amplifier;
Description: Channel Digital Amplifier;
Best Price: Please Contact Us;
Shipping by: DHL\UPS\FedEx\EMS\TNT\Aramex;
Lead Time: Lead Time;
Payment: Paypal\Tt\Western Union\ Trade Assurance;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Guangdong Global Well Electronic Limited

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

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