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BGA Electronic Components Tablet Circuit Board PCB Assembly Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$2.68

1,000-4,999 Pieces US$2.52

5,000-9,999 Pieces US$2.31

10,000-999,999 Pieces US$2.00

1,000,000+ Pieces US$1.30

Sepcifications

  • Metal Coating Silver
  • Mode of Production SMT&DIP
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO, UL
  • Customized Customized
  • Condition New
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Material Fr4
  • Board Layer 4
  • Board Thickness 1.6mm
  • Copper Thickness 1 Oz
  • Min. Line Width/Space 0.1mm
  • Min. Hole Size 0.2mm
  • Solder Mask Green/Blue/Red
  • Silkscreen White/ Black
  • Surface Finishing HASL-Lf
  • Lead Time 8-10 Working Days

Product Description

BGA Electronic Components Tablet Circuit Board PCB Assembly Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Please see our pcb catalog below: 1. ...

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BGA PCBA Board Comparison
Transaction Info
Price US$1.30-2.68 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece US$1.00-99.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification RoHS, ISO, UL RoHS RoHS RoHS RoHS, ISO, UL
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Silver;
Mode of Production: SMT&DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Solder Mask: Green/Blue/Red;
Silkscreen: White/ Black;
Surface Finishing: HASL-Lf;
Lead Time: 8-10 Working Days;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
Metal Coating: Gold;
Mode of Production: DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Accept;
Finished Board Thickness: 1.6mm;
Surface Finish: Enig;
Field: Screen;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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