| Specification |
Metal Coating: Anti-Flux Photo-Cured Ink;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
CPU: Px30;
ROM: 8GB;
RAM: 1GB;
USB: USB2.0-a *2;
System: Android 8.1;
Serial: Uart *1;
LCD Interface: 40pin*0.5 FPC Lvds/Mipi 40pin*0.5 FPC RGB;
Power Power: 12V/2A;
WiFi: 2.4G with Bluetooth;
4G: 4G/ Full Netcom, External Nano SIM Card Slot Suppo;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Customizable;
Mode of Production: Customizable;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
OEM/ODM: OEM/ODM;
Specifications: 8 Layers Fr4 PCB;
Quality: High;
Survice: Electronic Assembly;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Sided, Double-Sided, Multilayer;
Base Material: Fr4, Aluminum, Rogers, Ceramic;
Customized: Customized;
Condition: New;
Production Mode: Turnkey PCBA Assembly;
PCB Type: Rigid-Flex PCB;
Minimum Trace/Space: 3/3 Mil;
Surface Finish: HASL Lead-Free;
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