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Fast Prototype Flex PCB Board, Flexible Printed Circuit Board, PCB Assembly Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

  • Structure Single-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Computer with LCD Screen
  • Conductive Adhesive Anisotropic Conductive Adhesive
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Insulation Materials Organic Resin
  • Transport Package Vacuum Packaging
  • Specification ISO9001& ISO14001& SGS& UL
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Made in China
  • Thickness 0.10mm
  • Cu 35um/35um
  • Surface Enig
  • Solder Mask Yellow
  • Stiffener No

Product Description

Fast Prototype Flex PCB Board, Flexible Printed Circuit Board, PCB Assembly 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, ...

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PCB Board Comparison
Transaction Info
Price US$0.01-150.00 / Piece US$0.18-0.30 / Piece US$0.18-0.30 / Piece US$0.18-0.30 / Piece US$0.18-0.30 / Piece
Min Order 1 Piece 5 Pieces 5 Pieces 5 Pieces 5 Pieces
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification - Ohsas18001:2007,ISO14001:2004,ISO/Ts16949:2009 ISO Ohsas18001:2007,ISO14001:2004,ISO/Ts16949:2009 ISO Ohsas18001:2007,ISO14001:2004,ISO/Ts16949:2009 ISO Ohsas18001:2007,ISO14001:2004,ISO/Ts16949:2009 ISO
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Thickness: 0.10mm;
Cu: 35um/35um;
Surface: Enig;
Solder Mask: Yellow;
Stiffener: No;
Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Color: Customized;
Feature: Enclosed and Waterproof Can Used at Any Environmen;
Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Color: Customized;
Feature: Enclosed and Waterproof Can Used at Any Environmen;
Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Color: Customized;
Feature: Enclosed and Waterproof Can Used at Any Environmen;
Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Color: Customized;
Feature: Enclosed and Waterproof Can Used at Any Environmen;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Yizexin Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Yizexin Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Yizexin Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Yizexin Technology Co., Ltd.

Diamond Member Audited Supplier

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